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  • Single-Side FPC

    Standard FPC with one copper layer on one side of the polyimide film.

    Features

    FPC is thin and flexible and allows engineers to utilize space.

    FPC reduces overall system weight. Components can be mounted directly on the FPC.

    Basic structure


    Base Material
    Polyimide film   25μm(1mil)、12.5μm(1/2mil)
    Cu   12μm(1/3oz)、35μm(1oz)、17.5μm(1/2oz)
    Cover Material
    Polyimide film   25μm(1mil)、12.5μm(1/2mil)
    Resist ー
    Surface treatment Solder Electrolytic Plating
    Gold Electrolytic Plating
    Anti Corrosion(OSP)
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